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Contents • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • Field explanations [ ] The headers in the table listed below describe the following: • Model – The marketing name for the GPU assigned by AMD/ATI. Note that ATI trademarks have been replaced by AMD trademarks starting with the Radeon HD 6000 series for desktop and FirePro series for professional graphics. • Codename – The internal engineering codename for the GPU. • Launch – Date of release for the GPU. • Architecture – The microarchitecture used by the GPU. • Fab – Fabrication process.
This International Standard is applicable to pressure-relieving and vapour-depressuring systems. The latest edition of the referenced document (including any amendments) applies. ISO 4126 (all parts). American Petroleum Institute, 1220 L Street, N.W., Washington, D.C.,, USA. If you can think it, you can make it with Photoshop CC, the world’s best imaging and graphic design software. Create and enhance photographs, illustrations.
Average feature size of components of the GPU. • Transistors – Number of transistors on the die. • Die Size – Physical surface area of the die. • Core config – The layout of the graphics pipeline, in terms of functional units. • Core clock – The reference base and boost (if available) core clock frequency. • Fillrate • Pixel - The rate at which pixels can be rendered by the raster operators to a display. Measured in Pixels/s.
• Texture - The rate at which textures can be mapped by the texture mapping units onto a polygon mesh. Measured in Texels/s. • Performance • Shader operations - How many operations the pixel shaders (or unified shaders in Direct3D 10 and newer GPUs) can perform.
Measured in Operations/s. • Vertex operations - The amount of geometry operations that can be processed on the vertex shaders in one second (only applies to Direct3D 9.0c and older GPUs). Measured in Vertices/s.
• Memory • Bus type – Type of memory bus utilized. • Bus width – Maximum bit width of the memory bus utilized. • Size – Size of the graphics memory. • Clock – The reference memory clock frequency. • Bandwidth – Maximum theoretical memory bandwidth based on bus type and width. • TDP (Thermal design power) – Maximum amount of heat generated by the GPU chip, measured in Watt.
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• TBP (Typical board power) – Typical power drawn by the total board, including power for the GPU chip and peripheral equipment, such as VRM, memory, fans, etc., measured in Watt. • Bus interface – Bus by which the graphics processor is attached to the system (typically an expansion slot, such as,, or ). • API support – Rendering and computing supported by the GPU and driver.
Brief introduction to the relevant functional anatomy preceding the description of the physiological aspects in each section for better understanding of the subject. 
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Video codec acceleration [ ] • R100 - • R200 - Video Immersion II • R300 - Video Immersion II + • R410 - Video Shader HD • R420 - Video Shader HD + • R520 - • R600 - Avivo HD Video - 1.0 • R700 - UVD 2, UVD 2.2 • Evergreen - UVD 2.2 • Northern Islands - UVD 3 (HD 67xx UVD 2.2) • Southern Islands - UVD 3.1, 1.0 • Sea Islands - UVD 4.2, VCE 2.0 • Volcanic Islands - UVD 5.0, 6.0, VCE 3.0 • Arctic Islands - UVD 6.3, VCE 3.4 • Vega - UVD 7.0, VCE 4.0 Features Overview [ ] The following table shows features of Radeon-branded GPU microarchitectures. • The Radeon 100 Series has programmable pixel shaders, but do not fully comply with DirectX 8 or Pixel Shader 1.0. See article on. • These series do not fully comply with OpenGL 2+ as the hardware does not support all types of non power of two (NPOT) textures.